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Power PCBA

Wireless Charger PCBA

Bluetooth Module PCB

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Wireless Charger Receiver Module

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4 Layer PCB Board

6 Layer PCB Board

8 Layer PCB Board

Wireless Charger Coil

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Home Products Power PCBA

Mobile Phone Charger Power PCBA , Power Bank Circuit Board USB Type C

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Power PCBA (17)

Wireless Charger PCBA (20)

Bluetooth Module PCB (16)

Small OLED Display (28)

Wireless Charger Receiver Module (13)

2 Layer PCB Board (11)

4 Layer PCB Board (11)

6 Layer PCB Board (11)

8 Layer PCB Board (11)

Wireless Charger Coil (18)

Mobile Phone Charging Lockers (11)

Automatic Hand Sanitizer Dispenser Stand (6)

Electromagnetic Solenoid Lock (9)

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Certification

Mobile Phone Charger Power PCBA , Power Bank Circuit Board USB Type C

Large Image : Mobile Phone Charger Power PCBA , Power Bank Circuit Board USB Type C Get Best Price

Product Details:

Place of Origin:	Shenzhen,China
Brand Name:	Betterliv/OEM
Certification:	CE FCC ROHS
Model Number:	OEM

Payment & Shipping Terms:

Payment Terms:	T/T, Western Union, Credit Card

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Detailed Product Description

Board Thickness:	0.2mm-4.5mm	Min. Line Width:	0.08mm
Copper Thickness:	1/2 Oz-4 Oz	Finish Hole Size::	PTH ±0.003'' ,NPTH ±0.002"
Base Material::	FR4 CEM1 CEM3 Ceramic Aluminum	Board Thicknes:	0.2-4.0mm
SMT/DIP Service::	0.3mm IC,BGA,QFP,0201 Components	Surface Finishing:	HASL-LF/OSP/ENIG Etc
High Light:	Mobile Phone Charger Power PCBA , Type C Power Bank Circuit Board , Type-C Power Bank Circuit Board

Custom Power Bank PCBA Module Circuit Board USB Type-C Circuit Board Assembly for Mobile Phone Charger

PCB&PCBA Capacity

Material	FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc.
Board thickness	Mass production: 394mil(10mm) Samples: 17.5mm
Surface finish	HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
PCB Max panel size	1150mm × 560mm
Layer	Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
Min hole size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
PCBA QC	X-ray, AOI Test, Functional Test
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
Our service	PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
Sanforized	Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
SMT Capacity	700Million Points/Day
DIP Capacity	0.5Million Points/Day
Certificate	RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485

PCB/PCBA services

We can support your research and development efforts and meet your fast life cycles.We have set a separated department where the exclusive production planner will follow your orders production to meet the requirements of Rapid Prototyping and Quick Turn PCB.
We has been establishes quality system with ISO9001 and strictly implements the IPC class III standard to inspect the quality.100% inspectionincludes electric test and AOI inspection. It can carry out high voltage test, impedance test,microsection ,weldability test and otherprofessional tests to keep up with more demands from users of high-tech products.* CAM and BOM engineering * PCB and PCBA manufacture
* Materials management
* SMT and DIP assembly
* PCB and PCBA quick turn prototype
* Program and testing
* Cable assembly
* Function testing
* Final case assembly
* Package
* Logistics

Why Choose Us

Mobile Phone Charger Power PCBA , Power Bank Circuit Board USB Type C 0