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Certification
FR4 Power Supply Pcb Board Double Layer Pcba Electronics For Bluetooth Audio
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Product Details:
Payment & Shipping Terms:
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Detailed Product Description
| Board Thickness: | 0.2mm-4.5mm | Min. Line Width: | 0.08mm |
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| Copper Thickness: | 1/2 Oz-4 Oz | Finish Hole Size:: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material:: | FR4 CEM1 CEM3 Ceramic Aluminum | Board Thicknes: | 0.2-4.0mm |
| SMT/DIP Service:: | 0.3mm IC,BGA,QFP,0201 Components | Surface Finishing: | HASL-LF/OSP/ENIG Etc |
| High Light: | FR4 Power Supply Pcb Board Double Layer,Bluetooth Power Supply Pcb Board Double Layer,Bluetooth Supply Pcb Board Double Layer |
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Power Supply Design OEM PCBA FR4 Double Layer Printed Circuit Board
Advantages
1. Stable performance, strong signal reception, straight line distance above 10 meters
2. Input voltage: 5V-22V, (if 24V voltage is required, it can be customized separately)
3. Output power: 4 ohms 3W+3W
4. Two-in-one Bluetooth and power amplifier function, can be used when connected to the power supply and speaker, small space and large use. Reduce production wiring and assembly troubles and improve production yield.
Application
Bluetooth audio, massage chairs, household appliances, electric vehicles, toys, lighting, photovoltaic products, fitness equipment, etc.
Specification of PCBA Assembly
| PCBA Type of Assembly | SMT,DIP, Mixed(surface mount and through hole) technology,Cable assembly |
| Solder Type of electronic PCBA | Water Soluble Solder Paste,Leaded and Lead-Free |
| Minimum IC Pitch for OEM PCBA | 0.2mm |
| Minimum chip size PCBA board | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size SMT Assembly PCBA | 74x74mm |
| BGA ball pitch PCBA | 1.00mm (minimum),3.00mm (maximum) |
| BGA ball diameter Pcba Assembly | 0.40mm (minimum),1.00mm (maximum) |
| Components | BGA and VFBGA |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly pcba | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Passive components | |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Grid Arrays(BGA) | |
| As small as .5mm pitch | |
| Part Removal and Replacement | |
| Bare Board Size | Smallest:0.25*0.25 inches |
| Largest:20*20 inches | |
| File Formate | Bill of Materials |
| Gerber files | |
| Pick-N-Place file | |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | First prototype test before mass quantity production,Flying Probe Test,X-ray Inspection AOI Test,BGA X-ray, PCB E-test |
PCB/PCBA services
1. Test: ICT and functional with full tech and engineering support staff
2. FR-4, FR-4 High TG, CEM-1, CEM-3, Aluminum base material.
3. Single-sided PCB, double-sided PCB, multi-layer PCB, competitive price, good quality and good service.
4. Prototype qualifications through production volumes
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to medium and batch production.
Contact Details
Shenzhen Betterliv Technology Co., Ltd.
Contact Person: admin
Send your inquiry directly to us