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Product Details:
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Product Name: | Power Supply Module Design PCBA | Silkscreen Color: | Black.white.yellow.red.blue |
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SMT Efficiency: | BGA.QFP.SOP.QFN.PLCC.CHIP | Board Thickness: | 0.8-5.6mm |
Min. Hole Size: | 0.2mm | Surface Finishing: | HALS/HALS OSP Etc |
Testing Service: | 100% E-testing | ||
Highlight: | 5.6mm Power Bank Pcb Circuit,20 Layers Power Bank Pcb Circuit,20 Layers power bank pcb module |
OEM Power Bank PCBA Electrical Circuit Board Power Supply Module Design PCBA
Product Details
PCB assembly Layers | 1 Layers to 20 layer (standard, including HDI board ) |
PCB assembly material/type | FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
PCB Assembly service type | DIP/SMD or Mixed SMD & DIP |
Base material thickness | 0.2-3.6mm |
Copper thickness | 18um(H/HOZ),35um(1/1OZ),70um(2/2OZ),5OZ |
Assembly surface finish | Gold-plated, HASL,OSP, ENIG |
PCB Dimension (max) | 500*700mm |
IC Pitch(min) | 0.2mm |
Chip size(min) | 01005 |
Drilled hole size(min) | 0.075mm |
Track width/spacing(min) | 3mil |
IC Encapsulation type | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
Outline tolerance | ±0.1mm |
Hole diameter tolerance | ±0.076mm |
Hole location tolerance | ±0.076mm |
V-CUT tolerance | ±0.1mm |
PCB/PCBA capability and services
1. Singlesided PCB, double side PCB & multilayer PCB with competitive price, good quality and excellent service.
2. FR-4, FR-4 High TG, CEM-1, CEM-3, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium and batch production.
Contact Person: admin
Tel: +8615218738899